New thermally conductive adhesive for heat generating components

New thermally conductive adhesive for heat generating components

Thermally conductive 2K epoxy for heat generating parts

A new thermally conductive adhesive for bonding heat generating components in electronics assembly has recently been launched. This two part epoxy takes the bonding of items such as heatsink heat exchangers and LEDs up a level. Possible application methods include dual-syringes, mix-tips and automatic dispensing systems.

Technical data of the thermally conductive adhesive

This thermally conductive 2K epoxy is developed and launched by MG Chemicals. The adhesives measures 1.1W/(m. K) in thermal conductivity which works for 45 minutes. In room temperature, the curing takes place in 24 hours. However, if the temperature is raised to 65 C (149 F), the time span will be sped up to 2.5 hours.

The MG Chemical 8329TFM is a thixotropic adhesive which has good adherence to various substrates. Next to thermal conductivity, the adhesive also provides electric insulation, as well as is resistant to salt water, humidity, aliphatic hydrocarbons and mild bases. The shelf life of the smooth, grey adhesive exceeds three years.